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Vishay Siliconix
Single-Channel LITTLE FOOT R SC-70 3-Pin and 6-Pin MOSFET
Recommended Pad Pattern and Thermal Peformance
INTRODUCTION
This technical note discusses pin-outs, package outlines, pad
patterns, evaluation board layout, and thermal performance
for single-channel LITTLE FOOT power MOSFETs in the
SC-70 package. These new Vishay Siliconix devices are
intended for small-signal applications where a miniaturized
package is needed and low levels of current (around 350 mA)
need to be switched, either directly or by using a level shift
configuration. Vishay provides these single devices with a
range of on-resistance specifications and in both traditional
3-pin and new 6-pin versions. The new 6-pin SC-70 package
enables improved on-resistance values and enhanced
thermal performance compared to the 3-pin package.
PIN-OUT
Figure 1 shows the pin-out description and Pin 1 identification
for the single-channel SC-70 device in both 3-pin and 6-pin
configurations. The pin-out of the 6-pin device allows the use
of four pins as drain leads, which helps to reduce on-resistance
and junction-to-ambient thermal resistance.
SOT-323 SOT-363
SC-70 (3-LEADS) SC-70 (6-LEADS)
Top View Top View
G 1 D 1 6
BASIC PAD PATTERNS
See Application Note 826, Recommended Minimum Pad
Patterns With Outline Drawing Access for Vishay Siliconix
MOSFET s, ( http://www.vishay.com/doc?72286 ) for the basic
pad layout and dimensions for the 3-pin SC-70 and the 6-pin
SC-70. These pad patterns are sufficient for the low-power
applications for which this package is intended. Increasing the
pad pattern has little effect on thermal resistance for the 3-pin
device, reducing it by only 10% to 15%. But for the 6-pin
device, increasing the pad patterns yields a reduction in
thermal resistance on the order of 35% when using a 1-inch
square with full copper on both sides of the printed circuit board
(PCB). The availability of four drain leads rather than the
traditional single drain lead allows a better thermal path from
the package to the PCB and external environment.
EVALUATION BOARDS FOR THE SINGLE
SC70-3 AND SC70-6
Figure 2 shows the 3-pin and 6-pin SC-70 evaluation boards
(EVB). Both measure 0.6 inches by 0.5 inches. Their copper
pad traces are the same as described in the previous section,
Basic Pad Patterns . Both boards allow interrogation from the
outer pins to 6-pin DIP connections, permitting test sockets to
be used in evaluation testing.
S
2
3
D
D
G
2
3
5
4
The thermal performance of the single SC-70 has been
measured on the EVB for both the 3-pin and 6-pin devices, the
results shown in Figures 3 and 4. The minimum recommended
footprint on the evaluation board was compared with the
industry standard of 1-inch square FR4 PCB with copper on
both sides of the board.
FIGURE 1.
For package dimensions see outline drawings:
SC-70 (3-Leads) ( http://www.vishay.com/doc?71153 )
SC-70 (6-Leads) ( http://www.vishay.com/doc?71154 )
Front of Board SC70-3
ChipFET r
Document Number: 71236
12-Dec-03
Back of Board, SC70-3 and SC70-6
vishay.com
FIGURE 2.
Front of Board SC70-6
ChipFET r
www.vishay.com
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